Uniqarta Awarded National Science Foundation Grant for
Ultra-Fast MicroLED Placement
December 20 2017
Uniqarta has been awarded a Phase I Small Business Innovation Research grant to continue the development of its Laser Enabled Advanced Placement (LEAP) technology for microLED applications.
UMass Amherst Receives Massachusetts Grant in Support of Uniqarta Project
October 16, 2017
Massachusetts Governor Charlie Baker has announced a $500,000 grant to UMass Amherst in support of Uniqarta's NextFlex ultra-thin die assembly project. These funds will be used to purchase flexible hybrid electronics manufacturing equipment and support UMass's project participation.
Uniqarta Awarded Second NextFlex Project
March 8, 2017
Uniqarta has been awarded a subcontract from the University of Massachusetts Amherst to participate on a NextFlex project to develop and demonstration a wearable human health monitor
Uniqarta Awarded NetFlex Project
December 23, 2016
Uniqarta has been awarded an 18-month program to transfer certain aspects of its FlexChip™ ultra-thin die assembly solution to NextFlex for prototyping and low-volume manufacturing
Uniqarta Selected for Best University Startups Demo Day at Congress
August 31, 2016
Uniqarta has been selected by the National Council of Entrepreneurial Tech Transfer as one of 35 "Best University Startups" to participate in the inaugural University Startups Demo Day at the National Press Club and Congress on September 20.
Uniqarta Awarded 2nd National Science Foundation Grant
August 20, 2016
Uniqarta has been awarded a Phase II Small Business Innovation Research grant to further development of its FlexChip™ ultra-thin die assembly solution.
Uniqarta Presents at Advanced Packaging Forum
July 6, 2016
Co-Founder and CEO Ronn Kliger has been invited to present at this July 14, 2016 workshop in San Francisco on the topic of ultra-thin IC assembly.
NextFlex Announces $10M for Second Project Call
May 6, 2016
Flexible Hybrid Electronics Manufacturing Institute seeking proposals to further the development and adoption of flexible hybrid electronics.
Uniqarta Presents at Flexible Hybrid Electronics Forum
May 5, 2016
Founder and CTO Val Marinov has been invited to present at this July 12, 2016 workshop in San Francisco on the topic of ultra-thin IC assembly.
Uniqarta Presents at SEMICON West Silicon Innovation Forum
May 5, 2016
The National Science Foundation has sponsored Uniqarta's participation in this July 12, 2016 event in San Francisco highlighting new innovative technology and selected startups.
Uniqarta Presents at 2016 FLEX
March 3, 2016
Founder and CTO Val Marinov presented on the challenges and methods of making chips thin at the 2016 Flexible & Printed Electronics Conference in Monterey, CA.
FlexTech Alliance Team Receives $75 Million Department of Defense Flexible Hybrid Electronics Award
August 28, 2015
The Department of Defense has awarded a $75 million, five-year Cooperative Agreement to the FlexTech Alliance to establish and manage a Manufacturing Innovation Institute for Flexible Hybrid Electronics. Uniqarta was a core participant on the FlexTech proposal team and will be a founding member of the Institute. The White House, in its announcement, referred to "integrating ultra-thin silicon components" and "improving the connectivity of devices through the 'Internet of Things.'"
Uniqarta Presents at the Active & Intelligent Packaging Industry Association World Congress
August 26, 2015
Co-founder and CEO Ronn Kliger will present on the use of flexible hybrid electronics in smart packaging on November 19, 2015 in
Uniqarta Awarded National Science Foundation Research Grant
July 22, 2015
Uniqarta has been awarded a Phase I Small Business Innovation Research grant in support of research involving the embedding of integrated circuits in paper.
Uniqarta Presents at the International Microelectronics Assembly and Packaging Society
June 26, 2015
Founder and CTO Val Marinov will present on the making of "things" in the Internet of Things on October 27, 2015 in Orlando, Florida.
Uniqarta Founder Val Marinov Presents on the Internet of Things
June 26, 2015
Founder and CTO Val Marinov presented a technologist's view of the Internet of Things at the 16th International Conference on Computer Systems and Technologies in Dublin, Ireland
Uniqarta and North Dakota State University Research Foundation Sign Exclusive License Agreement
March 17, 2015
Uniqarta and NDSU/RF have entered into an exclusive license agreement supporting Uniqarta's commercialization of the Laser-Enabled Advanced Packaging technology developed at NDSU.
Uniqarta Joins the Active & Intelligent Packaging Industry Association
March 17, 2015
AIPIA is a global industry association promoting high tech packaging solutions to reduce cost, waste and fraud.
Uniqarta Exhibits at Connected Things 2015
February 26, 2015
Uniqarta exhibited samples of its ultra-thin embedded RFID technology at the Connected Things 2015 conference in Cambridge, Massachusetts.
President Obama Announces $75M Funding for Flexible Hybrid Electronics
December 11, 2014
"The vast majority of these electronic devices are made up of boxy, rigid circuit boards. But in the world around us, most things are not flat or boxy... Flexible hybrid electronics combine advanced materials that flex with thinned silicon chips to produce the next generation of electronic products seamlessly integrated into the things around us."
Uniqarta Joins the RAIN RFID Alliance
August 15, 2014
RAIN's mission is to promote the understanding, acceptance, and ubiquitous adoption of UHF RFID technology and applications to improve business and, ultimately, peoples' lives.
Uniqarta presents at RFID Journal LIVE!
April 10, 2014
CEO Ronn Kliger presented Uniqarta's technology at the RFID Journal LIVE! event in Orlando, Florida.
Uniqarta Founder Val Marinov Presents at the Document Security Alliance
October 17, 2013
Founder and CTO Val Marinov delivered aninvited presentation at the 2013 DSA meeting in Washington, D.C.