Uniqarta's Laser Enabled Advanced Placement (LEAP) is a non-contact approach by which a laser transfers dies from a carrier to a substrate with high precision and throughput. Multiple dies are transferred simultaneously with a single scanned laser thereby eliminating the need for mechanical motion. This enables placement rates exceeding 100 million units per hour—orders of magnitude higher than any other die placement technology.
A full wafer is attached to a transparent carrier using Uniqarta's proprietary dynamic release layer material and singulated. The dynamic release layer material at a given die location expands in response to laser energy and pushes the die down onto an underlying substrate.
The process can operate in either a single- or multi-beam mode. In single-beam mode, a laser is sequentially focused on different die locations using a scanner. In multi-beam mode, a pattern of beams are sequentially focused on groups of dies using a scanner.
This provides an ability to deal with bad dies that are typically on a wafer. Single-beam mode is first used to remove unwanted dies from the wafer. Multi-beam mode is then used to rapidly transfer arrays of known good dies. Finally, single-beam mode is used again to transfer individual dies to fill-in locations unpopulated due to the previous removal of bad dies. This ability to selectively remove and replace unwanted dies sets LEAP apart from other parallel placement approaches.
LEAP is a disruptive technology that places large quantities of known-good dies at unparallel transfer rates. It enables novel products such as micro-LED displays or solid-state lighting arrays at cost points never before possible.
Contact Uniqarta for more information.
(LEAP can be used with ultra-thin dies or those of conventional thickness.)